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SST39VF1682-70-4I-B3KE-T
Parallel Flash, 2.7 - 3.6 V, 16 Mbit, x8, 70 ns, -40°C to 85°C, TFBGA-48, RoHS
The Microchip Parallel Flash Memory is a versatile and high-performance storage solution designed for applications requiring reliable data retention and fast access times. With a density of 16 Mbit and an access time of 70 ns, this memory component is ideal for a wide range of embedded systems. It operates within a supply voltage range of 2.7V to 3.6V and is housed in a compact TFBGA-48 package, making it suitable for space-constrained designs. Engineered to withstand extreme temperatures from -
Full Specifications
About This Product
The Microchip Parallel Flash Memory is a versatile and high-performance storage solution designed for applications requiring reliable data retention and fast access times. With a density of 16 Mbit and an access time of 70 ns, this memory component is ideal for a wide range of embedded systems. It operates within a supply voltage range of 2.7V to 3.6V and is housed in a compact TFBGA-48 package, making it suitable for space-constrained designs. Engineered to withstand extreme temperatures from -40°C to 85°C, this flash memory ensures robust performance in demanding environments.
What is this product used for?
Suitable for design, repair, and production programs using NOR devices.
Typical Use Cases
Sourcing Support for This MPN
- MPN and package verification against your BOM or approved vendor list
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- Availability, lifecycle, and supply-risk discussion for procurement planning
- Packing, label, date-code, and requested document coordination
RFQ Checklist
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SST39VF1682-70-4I-B3KE-T
Microchip
The Microchip Parallel Flash Memory is a versatile and high-performance storage solution designed for applications requiring reliable data retention and fast access times. With a density of 16 Mbit and an access time of 70 ns, this memory component is ideal for a wide range of embedded systems. It operates within a supply voltage range of 2.7V to 3.6V and is housed in a compact TFBGA-48 package, making it suitable for space-constrained designs. Engineered to withstand extreme temperatures from -
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